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IEC 61189-2-808 2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808 Thermal resistance of an assembly by thermal transient method
IEC 61189-2-808 2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808 Thermal resistance of an assembly by thermal transient method
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本文档由 路人甲 于 2025-01-12 02:32:08上传分享