说明:收录25万 73个行业的国家标准支持批量下载

问:哪里下载IEC 61191-6 2010 Printed board assemblies - Part 6 Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method答:请联系微信:siduwenku

IEC 61191-6 2010 Printed board assemblies - Part 6 Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

文档预览

中文文档 83 页 50 下载 1000 浏览 0 评论收藏 3.0分

赞助4.2元下载(无需注册)

温馨提示：本文档共83页，可预览 3 页，如浏览全部内容或当前文档出现乱码,可开通会员下载原始文档

IEC 61191-6 2010 Printed board assemblies - Part 6 Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method 第 1 页

IEC 61191-6 2010 Printed board assemblies - Part 6 Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method 第 2 页

IEC 61191-6 2010 Printed board assemblies - Part 6 Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method 第 3 页

本文档由于 2025-03-27 23:22:42上传分享

下载原文档(0 bytes)

站内资源均来自网友分享或网络收集整理，若无意中侵犯到您的权利，敬请联系我们微信(点击查看客服)，我们将及时删除相关资源。